Sequimtech BLOG: Self-assembling of chips

Friday, January 15, 2010

Self-assembling of chips - technology

University of Minnesota researchers
have developed a method for
self-assembling and electrically
connecting small (20-60 micrometer)
semiconductor chiplets at
predetermined locations on flexible
substrates at high speed (62500
chips in 45 seconds). The process
could find uses in numerous
applications such as solar cells,
video displays, and...
http://www.kurzweilai.net/email/newsRedirect.html?newsID=11677&m=44681

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Friday, January 15, 2010

Self-assembling of chips - technology

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